LCP-GF
Glass fiber reinforced LCP is a modified product based on LCP pure resin matrix, compounded with different proportions (typically 15%~45%) of chopped or long glass fibers. The addition of glass fibers significantly enhances tensile strength, flexural strength, and flexural modulus, while improving mechanical property retention at elevated temperatures,GF-LCP retains the inherent excellent flowability and precision molding capability of the LCP matrix.
Basic Parameters
Grade | Density (g/cm³) | TensileStr. (MPa) | Flex.Str. (MPa) | Flex.Mod. (MPa) | IzodImp. (kJ/m²) | HDT (°C) | FlameRetardantRating （UL94） | MoldShrink. (%) |
LCP + 15% GF | 1.50~1.55 | 130~160 | 140~170 | 7,000~9,000 | 2.5~4.0 | 240~280 | ≥32 | 0.04~0.08 |
LCP + 30% GF | 1.60~1.70 | 160~200 | 170~220 | 12,000~16,000 | 2.0~3.5 | 280~320 | ≥35 | 0.02~0.06 |
LCP + 45% GF | 1.75~1.85 | 170~210 | 200~260 | 18,000~22,000 | 1.5~2.5 | 300~355 | ≥38 | 0.01~0.04 |
Performance Characteristics:
1)High strength and rigidity: 45% GF grade flexural modulus up to 20,000+ MPa
2)Excellent high-temperature performance: HDT up to 300°C+, meeting lead-free soldering requirements
3)Low creep characteristics: Minimal deformation under long-term high-temperature loading
4)Controllable anisotropy: Anisotropy degree adjustable through fiber length and content
5)Good dimensional stability: CLTE as low as (0.5~3.0)×10⁻⁵/°C
6)Retained flowability: Excellent thin-wall filling capability even at 45% high loading
Application:
1)SMT connectors: CPU sockets, memory slots, high-speed backplane connectors
2)Automotive electronics: Sensor housings, ECU connectors, ignition coil bobbins
3)Consumer electronics: Type-C interfaces, SIM card holders, antenna brackets
4)Industrial control: PLC terminal blocks, solenoid valve coil bobbins
5)Optical communication: Optical module interfaces, MPO connector housings
keywords: LCP-GF
classification: Product
Glass fiber reinforced LCP is a modified product based on LCP pure resin matrix, compounded with different proportions (typically 15%~45%) of chopped or long glass fibers. The addition of glass fibers significantly enhances tensile strength, flexural strength, and flexural modulus, while improving mechanical property retention at elevated temperatures,GF-LCP retains the inherent excellent flowability and precision molding capability of the LCP matrix.
Basic Parameters
Grade | Density (g/cm³) | TensileStr. (MPa) | Flex.Str. (MPa) | Flex.Mod. (MPa) | IzodImp. (kJ/m²) | HDT (°C) | FlameRetardantRating （UL94） | MoldShrink. (%) |
LCP + 15% GF | 1.50~1.55 | 130~160 | 140~170 | 7,000~9,000 | 2.5~4.0 | 240~280 | ≥32 | 0.04~0.08 |
LCP + 30% GF | 1.60~1.70 | 160~200 | 170~220 | 12,000~16,000 | 2.0~3.5 | 280~320 | ≥35 | 0.02~0.06 |
LCP + 45% GF | 1.75~1.85 | 170~210 | 200~260 | 18,000~22,000 | 1.5~2.5 | 300~355 | ≥38 | 0.01~0.04 |
Performance Characteristics:
1)High strength and rigidity: 45% GF grade flexural modulus up to 20,000+ MPa
2)Excellent high-temperature performance: HDT up to 300°C+, meeting lead-free soldering requirements
3)Low creep characteristics: Minimal deformation under long-term high-temperature loading
4)Controllable anisotropy: Anisotropy degree adjustable through fiber length and content
5)Good dimensional stability: CLTE as low as (0.5~3.0)×10⁻⁵/°C
6)Retained flowability: Excellent thin-wall filling capability even at 45% high loading
Application:
1)SMT connectors: CPU sockets, memory slots, high-speed backplane connectors
2)Automotive electronics: Sensor housings, ECU connectors, ignition coil bobbins
3)Consumer electronics: Type-C interfaces, SIM card holders, antenna brackets
4)Industrial control: PLC terminal blocks, solenoid valve coil bobbins
5)Optical communication: Optical module interfaces, MPO connector housings
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