LCP Resin
LCP (Liquid Crystal Polymer) pure resin is a high-performance thermoplastic engineering plastic based on aromatic polyester liquid crystal polymers. In the molten state, molecular chains align highly along the flow direction, forming a unique liquid crystalline structure. Pure resin products are classified into Type I (high heat-resistant), Type II (general-purpose), and Type III (low melting point) categories based on molecular structure and thermal properties, serving as the foundational material for all LCP modified products. The rigid rod-like structure of the molecular chains endows the material with exceptional dimensional stability, extremely low molding shrinkage, and outstanding high-temperature mechanical properties.
Basic Parameters
Grade | Density (g/cm³) | TensileStr. (MPa) | FlexStr. (MPa) | Flex.Mod. (MPa) | IzodImp. (kJ/m²) | HDT (°C) | FlameRetardantRating （UL94） | MoldShrink. (%) |
I型 LCP | 1.40~1.50 | 150~200 | 130~180 | 8,000~12,000 | 0.8~1.5 | 280~355 | ≥35 | 0.02~0.06 |
II型 LCP | 1.35~1.45 | 110~160 | 100~150 | 6,000~10,000 | 1.0~2.5 | 180~240 | ≥30 | 0.04~0.10 |
III型 LCP | 1.30~1.40 | 80~120 | 70~110 | 4,000~8,000 | 1.5~3.0 | 120~180 | ≥28 | 0.10~0.20 |
Performance Characteristics：
- Outstanding heat resistance: Type I LCP HDT up to 280~355°C, withstands high-temperature soldering
- Ultra-low molding shrinkage: Flow direction shrinkage as low as 0.02%~0.06% for precision molding
- Self-reinforcement effect: Liquid crystal orientation provides self-reinforcing properties in flow direction
- Excellent chemical resistance: Good corrosion resistance to most organic solvents, acids, and alkalis
- Extremely low water absorption: Water absorption <0.02%, ensuring dimensional stability unaffected by humidity
- High flame retardancy: Pure resin LOI ≥35%, easily achieving UL94 V-0 rating
- Exceptional flowability: Very low melt viscosity, suitable for thin-wall precision injection molding
Application：
1）Electronic connectors: SMT connectors, FPC connectors, board-to-board connectors
2）High-frequency communication devices: 5G antenna modules, mmWave radar housings
3）Precision relays: Automotive and industrial micro-relay housings
4）Semiconductor packaging: CSP/BGA substrate packaging materials
5）Medical devices: Minimally invasive surgical instruments, dental consumables
6）Fiber optic communication: Fiber optic connectors, optical transceiver module housings
keywords: LCP Resin
classification: Product
LCP (Liquid Crystal Polymer) pure resin is a high-performance thermoplastic engineering plastic based on aromatic polyester liquid crystal polymers. In the molten state, molecular chains align highly along the flow direction, forming a unique liquid crystalline structure. Pure resin products are classified into Type I (high heat-resistant), Type II (general-purpose), and Type III (low melting point) categories based on molecular structure and thermal properties, serving as the foundational material for all LCP modified products. The rigid rod-like structure of the molecular chains endows the material with exceptional dimensional stability, extremely low molding shrinkage, and outstanding high-temperature mechanical properties.
Basic Parameters
Grade | Density (g/cm³) | TensileStr. (MPa) | FlexStr. (MPa) | Flex.Mod. (MPa) | IzodImp. (kJ/m²) | HDT (°C) | FlameRetardantRating （UL94） | MoldShrink. (%) |
I型 LCP | 1.40~1.50 | 150~200 | 130~180 | 8,000~12,000 | 0.8~1.5 | 280~355 | ≥35 | 0.02~0.06 |
II型 LCP | 1.35~1.45 | 110~160 | 100~150 | 6,000~10,000 | 1.0~2.5 | 180~240 | ≥30 | 0.04~0.10 |
III型 LCP | 1.30~1.40 | 80~120 | 70~110 | 4,000~8,000 | 1.5~3.0 | 120~180 | ≥28 | 0.10~0.20 |
Performance Characteristics：
- Outstanding heat resistance: Type I LCP HDT up to 280~355°C, withstands high-temperature soldering
- Ultra-low molding shrinkage: Flow direction shrinkage as low as 0.02%~0.06% for precision molding
- Self-reinforcement effect: Liquid crystal orientation provides self-reinforcing properties in flow direction
- Excellent chemical resistance: Good corrosion resistance to most organic solvents, acids, and alkalis
- Extremely low water absorption: Water absorption <0.02%, ensuring dimensional stability unaffected by humidity
- High flame retardancy: Pure resin LOI ≥35%, easily achieving UL94 V-0 rating
- Exceptional flowability: Very low melt viscosity, suitable for thin-wall precision injection molding
Application：
1）Electronic connectors: SMT connectors, FPC connectors, board-to-board connectors
2）High-frequency communication devices: 5G antenna modules, mmWave radar housings
3）Precision relays: Automotive and industrial micro-relay housings
4）Semiconductor packaging: CSP/BGA substrate packaging materials
5）Medical devices: Minimally invasive surgical instruments, dental consumables
6）Fiber optic communication: Fiber optic connectors, optical transceiver module housings
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