Low Dielectric High-Frequency LCP
Low dielectric high-frequency LCP is a specialty LCP material developed specifically for 5G/6G communications, millimeter-wave radar, and high-frequency electronics. Through molecular structure design, filler optimization, and process refinement, this category achieves extremely low dielectric constant (Dk) and dissipation factor (Df), maintaining excellent signal integrity and low insertion loss in the 10GHz~110GHz high-frequency range. Low dielectric LCP is the ideal substrate for flexible high-frequency circuit boards and antenna modules.
Basic Parameters:
Grade | Density (g/cm³) | Tensile Str. (MPa) | Flex. Str. (MPa) | Flex. Mod. (MPa) | Izod Imp. (kJ/m²) | HDT (°C) | Flame Retardant Rating （UL94） | Dk / Df (10GHz) |
Film grade | 1.40~1.50 | 80~130 | 70~120 | 3,000~6,000 | — | 250~290 | ≥30 | 2.9~3.2 / 0.001~0.002 |
Injection molding grade | 1.50~1.60 | 100~150 | 110~160 | 7,000~10,000 | 1.5~3.0 | 260~300 | ≥32 | 3.0~3.5 / 0.002~0.004 |
High heat-resistant grade | 1.40~1.50 | 80~120 | 70~110 | 3,500~6,500 | — | 250~285 | ≥30 | 2.9~3.1 / 0.001~0.002 |
Performance Characteristics:
- Ultra-low dielectric constant: Dk 2.9~3.5 (10GHz), superior to PIMD and PTFE substrates
- Ultra-low dissipation factor: Df 0.001~0.004 (10GHz), extremely low high-frequency signal transmission loss
- Broadband stability: Dk and Df variation <5% across 1GHz~110GHz range
- Excellent heat resistance: HDT ≥250°C, meeting lead-free reflow soldering process requirements
- Low water absorption: <0.02%, dielectric properties unaffected by humidity
- Flexible processing: Can be made into 12μm~50μm ultra-thin films, suitable for flexible circuits
Application：
- 5G/6G antennas: Mobile antenna modules (AiP), base station antenna radiators
- High-frequency FPC: Flexible high-frequency transmission lines, high-speed differential signal lines
- Millimeter-wave radar: 77GHz automotive radar radomes and substrates
- Satellite communication: LEO satellite phased array antenna substrates
- High-speed connectors: 112G/224G high-speed backplane connectors
- AI servers: High-speed signal transmission cable substrates
keywords: Low Dielectric High-Frequency LCP
classification: Product
Low dielectric high-frequency LCP is a specialty LCP material developed specifically for 5G/6G communications, millimeter-wave radar, and high-frequency electronics. Through molecular structure design, filler optimization, and process refinement, this category achieves extremely low dielectric constant (Dk) and dissipation factor (Df), maintaining excellent signal integrity and low insertion loss in the 10GHz~110GHz high-frequency range. Low dielectric LCP is the ideal substrate for flexible high-frequency circuit boards and antenna modules.
Basic Parameters:
Grade | Density (g/cm³) | Tensile Str. (MPa) | Flex. Str. (MPa) | Flex. Mod. (MPa) | Izod Imp. (kJ/m²) | HDT (°C) | Flame Retardant Rating （UL94） | Dk / Df (10GHz) |
Film grade | 1.40~1.50 | 80~130 | 70~120 | 3,000~6,000 | — | 250~290 | ≥30 | 2.9~3.2 / 0.001~0.002 |
Injection molding grade | 1.50~1.60 | 100~150 | 110~160 | 7,000~10,000 | 1.5~3.0 | 260~300 | ≥32 | 3.0~3.5 / 0.002~0.004 |
High heat-resistant grade | 1.40~1.50 | 80~120 | 70~110 | 3,500~6,500 | — | 250~285 | ≥30 | 2.9~3.1 / 0.001~0.002 |
Performance Characteristics:
- Ultra-low dielectric constant: Dk 2.9~3.5 (10GHz), superior to PIMD and PTFE substrates
- Ultra-low dissipation factor: Df 0.001~0.004 (10GHz), extremely low high-frequency signal transmission loss
- Broadband stability: Dk and Df variation <5% across 1GHz~110GHz range
- Excellent heat resistance: HDT ≥250°C, meeting lead-free reflow soldering process requirements
- Low water absorption: <0.02%, dielectric properties unaffected by humidity
- Flexible processing: Can be made into 12μm~50μm ultra-thin films, suitable for flexible circuits
Application：
- 5G/6G antennas: Mobile antenna modules (AiP), base station antenna radiators
- High-frequency FPC: Flexible high-frequency transmission lines, high-speed differential signal lines
- Millimeter-wave radar: 77GHz automotive radar radomes and substrates
- Satellite communication: LEO satellite phased array antenna substrates
- High-speed connectors: 112G/224G high-speed backplane connectors
- AI servers: High-speed signal transmission cable substrates
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