PEEK High-Flow Granules
PEEK high-flow granules are modified grades developed through molecular structure optimization or addition of specialty flow promoters. The melt flow rate (MFR) is increased by 2~5 times vs. standard pure resin, enabling perfect filling at lower injection temperatures and pressures. Specifically designed for thin-wall parts (wall thickness <1mm), micro-precision parts, long-flow-path filling, and complex geometries, significantly reducing processing difficulty and cycle time while improving production efficiency and yield.
Technical Parameters：
Parameter | TEST Standard | WR-PTFE | WR-GF/PTFE | WR-CF/Graphite | WR-MoS₂ | Unit |
Density | ISO 1183 | 1.42 | 1.48 | 1.40 | 1.45 | g/cm³ |
Tensile Strength | ISO 527 | 80 | 130 | 170 | 95 | MPa |
Tensile Modulus | ISO 527 | 3.2 | 6.5 | 12.0 | 4.0 | GPa |
HDT (1.8MPa) | ISO 75 | 280 | 300 | 310 | 290 | °C |
Friction Coefficient | ASTM D3702 | 0.18 | 0.22 | 0.2 | 0.25 | — |
Wear Rate | ASTM D3702 | Very Low | Low | Very Low | Low | mm³/N·m |
Max pv Value | — | 1.5 | 2.5 | 5.0 | 1.0 | MPa·m/s |
Melting Temp. | ISO 11357 | 343 | 343 | 343 | 343 | °C |
Flammability | UL94 | V-0 | V-0 | V-0 | V-0 | — |
Performance Features：
1）Significantly increased melt flow rate; excellent thin-wall filling capability
2）Injection molding temperature can be reduced by 10~20°C; lower thermal degradation risk
3）Cycle time shortened by 15%~30%; significantly improved production efficiency
4）High replication accuracy of mold cavity; suitable for precision micro-feature molding
5）Retains PEEK's basic thermal, chemical, and flame retardant properties
6）Can be compounded with GF/CF for high-flow + reinforcement combination
Application：
Electronics Mfg.: Wafer carriers (thin-wall), SMT trays, micro-connectors
Precision Gears: Watch gears, micro transmission systems, precision reducer parts
Minimally Invasive Med: Handle of minimally invasive surgical instruments, endoscope parts (non-implantable)
Fiber Optic Comm.: Fiber optic connector ferrules, optical module housings
Consumer Electronics: Smartphone precision structural parts, wearable device components
keywords: PEEK High-Flow Granules
classification: Product
PEEK high-flow granules are modified grades developed through molecular structure optimization or addition of specialty flow promoters. The melt flow rate (MFR) is increased by 2~5 times vs. standard pure resin, enabling perfect filling at lower injection temperatures and pressures. Specifically designed for thin-wall parts (wall thickness <1mm), micro-precision parts, long-flow-path filling, and complex geometries, significantly reducing processing difficulty and cycle time while improving production efficiency and yield.
Technical Parameters：
Parameter | TEST Standard | WR-PTFE | WR-GF/PTFE | WR-CF/Graphite | WR-MoS₂ | Unit |
Density | ISO 1183 | 1.42 | 1.48 | 1.40 | 1.45 | g/cm³ |
Tensile Strength | ISO 527 | 80 | 130 | 170 | 95 | MPa |
Tensile Modulus | ISO 527 | 3.2 | 6.5 | 12.0 | 4.0 | GPa |
HDT (1.8MPa) | ISO 75 | 280 | 300 | 310 | 290 | °C |
Friction Coefficient | ASTM D3702 | 0.18 | 0.22 | 0.2 | 0.25 | — |
Wear Rate | ASTM D3702 | Very Low | Low | Very Low | Low | mm³/N·m |
Max pv Value | — | 1.5 | 2.5 | 5.0 | 1.0 | MPa·m/s |
Melting Temp. | ISO 11357 | 343 | 343 | 343 | 343 | °C |
Flammability | UL94 | V-0 | V-0 | V-0 | V-0 | — |
Performance Features：
1）Significantly increased melt flow rate; excellent thin-wall filling capability
2）Injection molding temperature can be reduced by 10~20°C; lower thermal degradation risk
3）Cycle time shortened by 15%~30%; significantly improved production efficiency
4）High replication accuracy of mold cavity; suitable for precision micro-feature molding
5）Retains PEEK's basic thermal, chemical, and flame retardant properties
6）Can be compounded with GF/CF for high-flow + reinforcement combination
Application：
Electronics Mfg.: Wafer carriers (thin-wall), SMT trays, micro-connectors
Precision Gears: Watch gears, micro transmission systems, precision reducer parts
Minimally Invasive Med: Handle of minimally invasive surgical instruments, endoscope parts (non-implantable)
Fiber Optic Comm.: Fiber optic connector ferrules, optical module housings
Consumer Electronics: Smartphone precision structural parts, wearable device components
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