PA9T
PA9T (Polyamide 9T) is a semi-aromatic polyamide produced by polycondensation of nonamethylenediamine and terephthalic acid, first commercialized by Kuraray (Japan). PA9T is characterized by extremely low water absorption (0.1–0.2%), excellent solder resistance, and good processability. With a melting point of ~306°C, it can be directly processed without copolymerization, making it ideal for SMT electronic connectors.
Basic Parameters
|
Parameter |
Value |
|
Formula |
[-NH-(CH2)9-NH-CO-C6H4-CO-]n |
|
Melting Point (°C) |
≈306°C |
|
Tg (°C) |
≈85°C |
|
Density (g/cm3) |
1.13–1.14 |
|
Water Absorption (%, 23°C/50%RH) |
0.1–0.2 |
|
Mold Shrinkage (%) |
0.2–0.5 |
|
Tensile Strengthc (MPa) |
165-185 |
|
Flexural Modulus (MPa) |
9000-11000 |
Performance Characteristics:
Extremely low water absorption: 0.1–0.2%, lowest among PPAs
Excellent solder resistance: withstands lead-free reflow (260°C+)
Direct processability: pure PA9T can be injection molded without copolymerization
Excellent chemical resistance: oils, solvents, coolants
High continuous use temp: above 150°C
Outstanding dimensional stability: minimal change at high T/humidity
Good toughness & creep resistance
Product Series：
General purpose: unfilled / GF30%–45%
High-flow: thin-wall connector molding
Flame-retardant: halogen-free V0
Impact-modified
High-rigidity: high GF content
Hydrolysis-resistant: automotive cooling
Low-warp: mineral/GF hybrid
Application：
Electronic connectors: SMT, FPC, board-to-board connectors
Automotive under-hood: sensor housings, thermostats, connectors
Electrical: circuit breakers, switches
LED lighting: brackets, lamp holders
Industrial: high-temp structural parts, pump components
keywords: PA9T
classification: Product
PA9T (Polyamide 9T) is a semi-aromatic polyamide produced by polycondensation of nonamethylenediamine and terephthalic acid, first commercialized by Kuraray (Japan). PA9T is characterized by extremely low water absorption (0.1–0.2%), excellent solder resistance, and good processability. With a melting point of ~306°C, it can be directly processed without copolymerization, making it ideal for SMT electronic connectors.
Basic Parameters
|
Parameter |
Value |
|
Formula |
[-NH-(CH2)9-NH-CO-C6H4-CO-]n |
|
Melting Point (°C) |
≈306°C |
|
Tg (°C) |
≈85°C |
|
Density (g/cm3) |
1.13–1.14 |
|
Water Absorption (%, 23°C/50%RH) |
0.1–0.2 |
|
Mold Shrinkage (%) |
0.2–0.5 |
|
Tensile Strengthc (MPa) |
165-185 |
|
Flexural Modulus (MPa) |
9000-11000 |
Performance Characteristics:
Extremely low water absorption: 0.1–0.2%, lowest among PPAs
Excellent solder resistance: withstands lead-free reflow (260°C+)
Direct processability: pure PA9T can be injection molded without copolymerization
Excellent chemical resistance: oils, solvents, coolants
High continuous use temp: above 150°C
Outstanding dimensional stability: minimal change at high T/humidity
Good toughness & creep resistance
Product Series：
General purpose: unfilled / GF30%–45%
High-flow: thin-wall connector molding
Flame-retardant: halogen-free V0
Impact-modified
High-rigidity: high GF content
Hydrolysis-resistant: automotive cooling
Low-warp: mineral/GF hybrid
Application：
Electronic connectors: SMT, FPC, board-to-board connectors
Automotive under-hood: sensor housings, thermostats, connectors
Electrical: circuit breakers, switches
LED lighting: brackets, lamp holders
Industrial: high-temp structural parts, pump components
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